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Cadence and TSMC Join Forces to Revolutionize AI Chip Design

9/25/2025

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Story summary
  • Cadence Design Systems partners with Taiwan Semiconductor Manufacturing Company (TSMC) to boost AI and HPC design automation.
  • The collaboration spans 3D-ICs and photonics on TSMC's N3, N2, and A16 process nodes.
  • AI-driven design solutions optimize power, performance, and area for TSMC N2.
  • TSMC validates AI-driven features to accelerate AI chip development.