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Huawei Seeks Patent for Advanced Chip Manufacturing Technique

12/4/2025

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Story summary
  • Huawei Technologies is pursuing a patent for a metal integration technique.
  • The technique could enable 2-nanometre chip manufacturing using deep ultraviolet lithography.
  • The approach aims to circumvent US sanctions on EUV lithography tools.
  • The patent, submitted in June 2022 and revealed in January 2025, remains unimplemented.
  • A Chinese chip industry expert suggested that 14-nm logic chips might compete with Nvidia’s 4-nm chips through memory integration and architecture.