Back to today’s briefing

Story perspectives

Intel's AI Chiplet Design Promises 12x Model Growth

12/27/2025

32 2

Summary

Story summary

Intel Corporation is developing a multi-chiplet package for AI and HPC featuring 16 compute elements and 24 HBM5 memory stacks.
The design could reach up to 12 times the size of existing AI models.
Intel uses Foveros Direct 3D technology to improve connectivity and power delivery.
The company aims to produce these packages by end of decade and compete with Taiwan Semiconductor Manufacturing Company (TSMC), despite stability and cooling challenges.

1 of 1

Story summary

Intel Corporation is developing a multi-chiplet package for AI and HPC featuring 16 compute elements and 24 HBM5 memory stacks.
The design could reach up to 12 times the size of existing AI models.
Intel uses Foveros Direct 3D technology to improve connectivity and power delivery.
The company aims to produce these packages by end of decade and compete with Taiwan Semiconductor Manufacturing Company (TSMC), despite stability and cooling challenges.