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Story summary
- SK Hynix Inc. plans to invest 19 trillion won ($12.9 billion) to build a chip packaging plant in Cheongju, South Korea.
- The project aims to meet rising demand for high-bandwidth memory (HBM) chips driven by AI.
- Construction will start in April, with completion by the end of 2027.
- The company, a leading HBM supplier to Nvidia, expects 33% annual growth in the HBM market from 2025 to 2030.
