Story perspectives

AI Surge Drives Innovations in Semiconductor Chip Design

3/13/2026

Summary

Story summary

The AI demand for significant computing power is reshaping the semiconductor industry.
NVIDIA Corporation and Advanced Micro Devices, Inc. (AMD) are developing heterogeneous chiplets in advanced packages that integrate multiple CPUs and GPUs with high-bandwidth memory (HBM).
This complexity requires new testing strategies, with a shift toward known-good testing for dies, interposers, and stacks.
Thermal management becomes critical due to increased heat, driving innovative cooling solutions.

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Story summary

The AI demand for significant computing power is reshaping the semiconductor industry.
NVIDIA Corporation and Advanced Micro Devices, Inc. (AMD) are developing heterogeneous chiplets in advanced packages that integrate multiple CPUs and GPUs with high-bandwidth memory (HBM).
This complexity requires new testing strategies, with a shift toward known-good testing for dies, interposers, and stacks.
Thermal management becomes critical due to increased heat, driving innovative cooling solutions.