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China Develops Diamond-Copper Material to Boost AI Data Center Cooling 80%

4/17/2026

Summary

Story summary

Ningbo Institute of Industrial Technology researchers developed a diamond-copper material that can boost cooling efficiency in AI data centers by up to 80%.
The material targets overheating in new-generation chips caused by higher power density.
China currently relies on imported heat-dissipation materials, underscoring the need for a domestic thermal-management industry.
The composite has thermal conductivity above 1,000 watts per metre-kelvin and is used in an AI node in Zhengzhou.

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Story summary

Ningbo Institute of Industrial Technology researchers developed a diamond-copper material that can boost cooling efficiency in AI data centers by up to 80%.
The material targets overheating in new-generation chips caused by higher power density.
China currently relies on imported heat-dissipation materials, underscoring the need for a domestic thermal-management industry.
The composite has thermal conductivity above 1,000 watts per metre-kelvin and is used in an AI node in Zhengzhou.