Full Breakdown
Huawei Unveils New Chip Design Path Aiming for 1.4nm-Equivalent Process by 2031
5/25/2026, 11:42:12 AM
Core Development & Context
On 25 May 2026 Huawei announced a plan to achieve transistor density comparable to a 1.4-nm process by 2031. The strategy relies on a “Tau (?) Scaling Law” and a “LogicFolding” architecture that shortens internal wiring and speeds signal travel. He Tingbo, president of Huawei’s semiconductor business and director of its Scientist Committee, presented the approach at a Shanghai symposium. Huawei says it has designed and mass-produced 381 chips using the Tau Scaling Law over the past six years. The first Kirin mobile chips using LogicFolding are slated for autumn 2026, produced with partner Semiconductor Manufacturing International Corp (SMIC). The target is set against Taiwan Semiconductor Manufacturing Co (TSMC), which expects mass-production of 1.4 nm chips in 2028. The announcement follows Huawei’s 2019 U.S. blacklist, which forced a “survival mode” and a 2023 comeback with SMIC’s 7-nm Mate 60 chipset.
Why It Matters
If the approach works, it could reduce China’s reliance on EUV lithography, challenge U.S. export controls, and reshape AI-chip competition traditionally led by Nvidia. It also marks a shift from geometric transistor scaling to system-level efficiency scaling.
Official Statements & Responses
Huawei’s press release called the Tau Scaling Law a “sustainable evolution” that cuts signal travel time. He Tingbo emphasized openness and collaboration. Omdia’s He Hui called the shift “credible” for extracting performance under lithography limits. IDC’s Kitty Fok said the law could become a reference point for overcoming process-node constraints. Nvidia’s Jensen Huang noted the company has “largely conceded” the Chinese market to Huawei.
Criticism & Opposition
Analysts point out the lack of independent performance verification and question whether LogicFolding can replace EUV-based manufacturing at scale. Observers note that China still trails global leaders in advanced process technology, making the 2031 target uncertain.
Conflicting Reports & Gaps
Sources differ on SMIC’s share reaction (7.6 % vs 19 %). The gap to TSMC is described as five years in some reports and three years in others. The scaling principle is variously named “Tau Scaling Law,” “Her’s Law,” or “time scaling.” No third-party data confirm the claimed transistor density.
Verbatim Quotes
- “What Huawei is proposing is a shift from traditional node-driven scaling to system-level efficiency scaling,” — He Hui, Omdia
- “We saw time scaling can deliver strong benefits across devices, circuits, chips and systems,” — He Tingbo, Huawei
- “chipmaker had "conceded" the Chinese market to Huawei.” — Jensen Huang, Nvidia CEO
- “This year we have prepared a surprise for the whole industry. Not saturation, not continuation, but a big leap ahead,” — He Tingbo, Bloomberg interview
What’s Next
Huawei will ship LogicFolding-based Kirin chips with its Mate 90 series in September 2026, then pursue higher-density designs toward the 2031 milestone. Industry watchers will monitor SMIC’s production runs and any independent performance benchmarks that emerge.
