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Samsung, Broadcom Ink $200B AI Pact, Supply 2nm Memory

7/27/2026

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Summary

Story summary

Samsung Electronics and Broadcom signed an MOU at the AI Summit in San Francisco, targeting over $200 billion through 2030.
Samsung will supply High Bandwidth Memory for Broadcom’s AI accelerators and use its 2-nm (and below) process for Broadcom’s products.
Samsung DS Vice Chairman and CEO Young Hyun Jun said the agreement’s 2.3D and 2.5D integration on Samsung’s 2nm node will add value as AI infrastructure scales.

History

Historical Context

JEDEC standardized HBM in 2013 and SK Hynix produced the first chip, enabling AMD’s Fiji GPU with HBM in 2015. Samsung started HBM2 mass production in 2016, moved to HBM3 in 2022 and plans 2-nm nodes by 2025. Leveraging this legacy, Samsung’s leadership signed a 2024 MOU with Broadcom to pursue a $200 billion AI roadmap using sub-2-nm technology.

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Story summary

Samsung Electronics and Broadcom signed an MOU at the AI Summit in San Francisco, targeting over $200 billion through 2030.
Samsung will supply High Bandwidth Memory for Broadcom’s AI accelerators and use its 2-nm (and below) process for Broadcom’s products.
Samsung DS Vice Chairman and CEO Young Hyun Jun said the agreement’s 2.3D and 2.5D integration on Samsung’s 2nm node will add value as AI infrastructure scales.

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