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Story summary
- Xiaomi unveiled the Xring O3 processor for its upcoming flagship foldable phone.
- TSMC will fabricate the Xring O3 with its 3-nanometre process technology.
- Xiaomi aims to ship 200,000–300,000 Xring O3 units for the foldable device.
- Cumulative shipments of Xring O1 devices have surpassed one million units.
- Xiaomi plans the Xring O100 neural-processing unit for its MiMo AI model by 2027.
