Back to today’s briefing

Story perspectives

Samsung Opens Yokohama Lab for AI-HBM Packaging

9/9/2026

9 2 Full Breakdown

Summary

Story summary

Samsung Electronics opened an Advanced Package Lab in Yokohama, Japan on September 8, 2026.
Vice Chairman Jun Young-hyun led the ceremony and will serve as the lab’s representative director.
Samsung is investing 40 billion yen through 2028, including 22.5 billion yen from METI.
The lab will develop packaging that merges AI accelerators with HBM, partnering with 50 Japanese firms.
Around 95 researchers work there, with a target of over 100 by 2027.

History

Historical Context

Intel’s overseas expansion, including assembly sites in China, grew with a $20 billion Fab in New Albany, Ohio announced in 2022 and the IDM 2.0 strategy unveiled in 2021. Samsung’s 2026 Advanced Package Lab in Yokohama, led by Vice Chairman Jun Young-hyun, adds Japan’s METI-backed significant AI-hardware hub, intensifying strategic global regional chip competition.

1 of 2

Story summary

Samsung Electronics opened an Advanced Package Lab in Yokohama, Japan on September 8, 2026.
Vice Chairman Jun Young-hyun led the ceremony and will serve as the lab’s representative director.
Samsung is investing 40 billion yen through 2028, including 22.5 billion yen from METI.
The lab will develop packaging that merges AI accelerators with HBM, partnering with 50 Japanese firms.
Around 95 researchers work there, with a target of over 100 by 2027.

1 / 2