Full Breakdown
SK Hynix Explores U.S. Memory-Chip Production Options with Intel
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Core Event
On September 16, 2026, Reuters reported that South Korean memory-chip maker SK Hynix is in early, exploratory talks with Intel about manufacturing memory chips in the United States for the first time. Two principal structures were described: a lease of part of Intel’s under-construction Ohio semiconductor campus, and a joint venture that could also involve major cloud-service providers. The company added that no decisions have been made regarding either scenario.
Background & Context
The potential U.S. footprint would mark SK Hynix’s first front-end wafer-fabrication activity on American soil. The firm already operates an advanced-packaging and research facility in West Lafayette, Indiana, announced on April 3, 2024, with mass production of high-bandwidth memory (High Bandwidth Memory (HBM)) targeted for the second half of 2029. The Ohio site, originally announced by Intel on January 21, 2022, is a roughly 1,000-acre campus in New Albany slated to become operational between 2030 and 2031. Intel’s Ohio investment, part of a broader U.S. chip-building push, has attracted interest from multiple customers seeking domestic memory supply.
Data & Statistics
- Intel shares rose up to 6.4 % and SK Hynix’s U.S.–listed stock gained as much as 3.3 % after the report.
- SK Hynix’s South Korea-listed shares have risen about 400 % over the past year, reflecting strong demand for HBM used in AI accelerators.
- The Indiana facility represents a $3.8-$4 billion investment and will create more than a thousand jobs.
- Intel’s Ohio campus is projected to require up to $100 billion to reach full capacity, according to Intel estimates.
Official Statements & Responses
Intel declined to comment on the specific Reuters report but reaffirmed its commitment to the Ohio investment and its broader foundry strategy under CEO Lip-Bu Tan.
U.S. Commerce Secretary Howard Lutnick has publicly urged SK Hynix and other Asian memory makers to expand U.S. production to alleviate the global chip shortage. He warned that companies without a U.S. manufacturing base could face tariffs of up to 100 percent.
Regulatory and Policy Pressures
South Korea’s Industrial Technology Protection Act treats advanced memory technologies such as HBM and Dynamic Random Access Memory (DRAM) as strategically sensitive. Reuters noted that any U.S. manufacturing deal could trigger a government review under this law. Seoul is simultaneously encouraging domestic chip clusters in the country’s southwest, adding a potential hurdle for overseas expansion.
Conflicting Reports & Gaps
Sources differ on the precise nature of the memory products that might be produced at the Ohio site; Reuters could not determine whether DRAM, NAND, or HBM would be manufactured. An exclusive report by JoongAng Ilbo claimed SK Hynix intended to purchase Intel’s Ohio plant outright, a claim the company denied. Additionally, while the lease scenario is viewed as more realistic, no source confirmed which option, if any, will ultimately be pursued.
What’s Next
The discussions remain exploratory, and no timeline for a decision has been disclosed. Analysts suggest that a finalized agreement could provide Intel with a marquee customer for its foundry business and help the U.S. government meet its goal of expanding domestic semiconductor manufacturing under the CHIPS Act. SK Hynix’s ongoing Indiana buildout will proceed independently of the Ohio talks, with mass production of HBM expected in the latter half of 2029.