CXMT Targets Server Memory Market with 4F² DDR5 RDIMM Launch

• October 10 (scheduled) – CXMT President Cao Kanyu announced at the 4th Integrated Chips and Chiplet Conference that the company’s self-developed 4F² DRAM architecture has reached a breakthrough stage and that a next-generation DDR5 RDIMM server-grade chip based on this architecture is slated for release by the end of 2026.

Global Times

China’s domestic DRAM industry has moved from a “catch-up” phase to a position of measurable global influence. At the 2026 World Manufacturing Convention, CXMT reported mass production of its fifth-generation (G5) DRAM platform and commercial deployment of an LPDDR6 chip. Counterpoint Research data show CXMT’s global DRAM revenue share rose to about 10 percent in Q2 2026, up from 4 percent a year earlier, making it the world’s fourth-largest DRAM supplier. The shift follows a broader strategy of first achieving scale in commodity DRAM and then advancing to higher-end applications such as server memory.

CXMT's G5 platform enters mass production as global share tops 10% — Chinese DRAM joins the first tier — BigGo Finance Global TimesCXMT's 4F² Architecture to Land by Year-End, First Product Targeting Server DDR5 RDIMM — BigGo Finance Zhu Yiming's Two Ventures: GigaDevice and CXMT Forge the Twin Pillars of China's Memory Chip Industry — BigGo Finance SK Chief Urges Faster Chip Fab Buildout as Micron, CXMT Close In

The 4F² architecture reduces the memory-cell footprint from the industry-standard 6F² to 4F², a change that can raise cell density by 30-50 percent. CXMT’s implementation relies on a Vertical Surrounded Gate (VSG) transistor that improves gate control, mitigates leakage current, and lessens short-channel effects. More than 300 patent families related to the 4F² approach have been published by CXMT, underscoring the company’s IP commitment. The architecture also enables wafer-level hybrid bonding, allowing separate optimization of memory-array and peripheral-logic processes.

CXMT's 4F² Architecture to Land by Year-End, First Product Targeting Server DDR5 RDIMM — BigGo Finance Global TimesCXMT's G5 platform enters mass production as global share tops 10% — Chinese DRAM joins the first tier — BigGo Finance Zhu Yiming's Two Ventures: GigaDevice and CXMT Forge the Twin Pillars of China's Memory Chip Industry — BigGo Finance SK Chief Urges Faster Chip Fab Buildout as Micron, CXMT Close In

• Global DRAM market shares (Q2 2026) – Samsung Electronics 39 %, SK Hynix 26 %, Micron Technology 25 % (industry report, August 4).

CXMT's G5 platform enters mass production as global share tops 10% — Chinese DRAM joins the first tier — BigGo Finance

• CXMT – 10 % share (Counterpoint Research).

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• Financial performance (first half 2026) – Revenue 150.31 billion yuan (? $22.5 billion); net profit 77.605 billion yuan (? $11.6 billion); gross margin 84.84 % (company filing).

CXMT's G5 platform enters mass production as global share tops 10% — Chinese DRAM joins the first tier — BigGo Finance

Analysts note that successful server-grade implementation would place CXMT among the few vendors capable of supplying high-performance memory, potentially adding pressure on the established “top three” manufacturers.

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• Chey Tae-won, SK Group chairman, warned that “if China or Micron of the U.S. expands capacity at a faster pace, South Korea’s market share shrinks,” calling for accelerated fab expansion in South Korea.

SK Chief Urges Faster Chip Fab Buildout as Micron, CXMT Close In

• “While the world's top three memory makers are advancing their own 4F² or similar 3D DRAM road maps, none has achieved large-scale commercialization yet,” — Tian

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• “It implies progress in new chip manufacturing, packaging, testing and reliability engineering,” — Tian

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• “If China or Micron of the U.S. expands capacity at a faster pace, South Korea's market share shrinks,” — Group Chairman Chey, SK group chairman

SK Chief Urges Faster Chip Fab Buildout as Micron, CXMT Close In

CXMT plans to qualify the DDR5 RDIMM for server-grade reliability and begin volume shipments by the end of 2026. Successful qualification would allow the chip to compete directly with products from Samsung, SK Hynix, and Micron in data-center deployments, potentially reshaping the high-end DRAM market.

Global Times