$63 B Financing Deal Fuels Anthropic’s AI Compute Expansion

On October 26, Bank of America, Citigroup, Morgan Stanley and Blackstone committed $63 billion of financing for Broadcom’s AI accelerators and networking equipment to be leased to Anthropic, creator of the Claude models. A newly formed special-purpose vehicle (SPV) will purchase the hardware and lease it to Anthropic, with deliveries slated for 2027.

Banks Structure $63 Billion Anthropic AI Financing, Deepening Exposure to AI Infrastructure

Anthropic’s prior funding came from equity rounds, including a $30 billion Series G in February 2026 and a $65 billion Series H in May 2026, both backed by Amazon. This deal is the first large-scale debt-backed structure for the company’s compute assets, bringing banks and private-credit investors into its capital base.

Banks Structure $63 Billion Anthropic AI Financing, Deepening Exposure to AI Infrastructure

• Total committed financing: $63 billion.

Four Financial Giants Are Lending $63 Billion for Anthropic's AI Chips

• First-lien (senior) loans: About $43.5 billion (?69 % of the commitment), arranged by Bank of America, Citigroup and Morgan Stanley.

Four Financial Giants Are Lending $63 Billion for Anthropic's AI Chips

• Second-lien financing: Provided by Blackstone.

Four Financial Giants Are Lending $63 Billion for Anthropic's AI Chips

• Residual value support (RSV): Broadcom will guarantee part of the loan value, protecting lenders from hardware-market declines.

Broadcom, big banks line up $63 billion in AI financing for Anthropic

• Off-balance-sheet arrangement: The SPV isolates the financing from the banks’ balance sheets.

Banks Structure $63 Billion Anthropic AI Financing, Deepening Exposure to AI Infrastructure

• October 26: Announcement of the financing package.

Banks Structure $63 Billion Anthropic AI Financing, Deepening Exposure to AI Infrastructure

• October 27: Broadcom’s shares rose roughly 3.3 % in pre-market trading.

Broadcom Rises Over 3% Premarket: Wall Street Banks and Blackstone Partner to Provide $63 Billion Financing to Support Anthropic's Purchase of Broadcom AI Chips

• 2027: Start of hardware deliveries under the Broadcom-Anthropic compute agreement.

Broadcom, big banks line up $63 billion in AI financing for Anthropic

Bank of America’s co-president Jim DeMare highlighted the need to turn AI plans into infrastructure. Broadcom CEO Hock Tan noted the “extraordinary pace” of AI compute growth and Broadcom’s capacity to support it. The banks described the transaction as a milestone for scaling AI compute with robust risk safeguards.

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Public disclosures have not detailed the exact composition of the second-lien portion or the full terms of Broadcom’s residual-value guarantee. Sources confirm the $43.5 billion senior-loan figure, but the remaining $19.5 billion remains undisclosed.

Four Financial Giants Are Lending $63 Billion for Anthropic's AI Chips

• “Advancing AI responsibly requires turning ambitious technology plans into tangible compute infrastructure,” — Jim DeMare, Co-President, Bank of America

Blackstone and banks commit US$ 63 billion deal to fund Anthropic’s AI infrastructure

• “This transaction brings together Broadcom’s leading technology and significant bank capital to accelerate the buildout of compute capacity that will power the next wave of AI innovation.” — Jon Gray, President and COO, Blackstone

Blackstone and banks commit US$ 63 billion deal to fund Anthropic’s AI infrastructure

The SPV will begin purchasing Broadcom XPU AI accelerators and networking gear, with first shipments expected in 2027. Lenders plan to float the senior bonds to the broader market after hardware delivery, while Broadcom’s RSV and the banks’ risk-mitigation frameworks will influence the financing’s impact on Anthropic’s compute capacity and the AI-infrastructure credit market.

Broadcom, big banks line up $63 billion in AI financing for Anthropic