Story perspectives

TSMC Expands in Arizona Amid Chip Packaging Bottleneck

4/9/2026

Summary

Story summary

The chipmaking process faces a potential bottleneck as advanced packaging, used to connect multiple chip dies, is mainly conducted in Asia.
Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding with new plants in Arizona to shorten turnaround times.
NVIDIA Corporation has secured most of TSMC's advanced CoWoS (chip-on-wafer-on-substrate) technology.
TSMC currently packages all chips in Taiwan.
Intel Corporation packages chips for clients including Amazon and Cisco.

1 of 1

Story summary

The chipmaking process faces a potential bottleneck as advanced packaging, used to connect multiple chip dies, is mainly conducted in Asia.
Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding with new plants in Arizona to shorten turnaround times.
NVIDIA Corporation has secured most of TSMC's advanced CoWoS (chip-on-wafer-on-substrate) technology.
TSMC currently packages all chips in Taiwan.
Intel Corporation packages chips for clients including Amazon and Cisco.