Story perspectives

Tata, ASML Ink $11 B Wafer Fab Deal in India

5/22/2026

Summary

Tata Electronics Launches Fab

Tata Electronics CEO Randhir Thakur and ASML President Christophe Fouquet signed an MoU with Narendra Modi and Rob Jetten present.
The $11 billion project will build a 300 mm wafer fab using ASML lithography tools.
The fab will produce 28-nm to 110-nm chips for automotive, mobile and AI with Powerchip Semiconductor Manufacturing Corp.
ASML will also support talent development, supply-chain resilience and R&D, with first chips expected before the end of 2026.

Summary

India Boosts Semiconductors

CG Power secured Rs 9,000 m (US$99.2 m) export orders for US data-center transformers on 16 Jan 2026.
Kaynes Technology’s OSAT pilot line is operational, with Unit 2 and PCB Unit 1 due to start by July 2026 in Gujarat.
MosChip Technologies plans to acquire a 73 % stake in Vayavya Labs pending statutory and regulatory approvals.
The India-Netherlands pact will set up a Dutch Semiconductor Competence Centre to work with India Semiconductor Mission supporting startups and SMEs.

History

Historical Context

Building on the 2022 CHIPS and Science Act that launched U.S.–India defense semiconductor projects, India and the United States announced in 2024 a joint effort to expand the India Semiconductor Mission. The plan follows the September 21 2024 reveal of the $500 million Shakti fab, slated to begin phase-one production in 2027 and support AI-chip self-sufficiency by 2026.

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Tata Electronics Launches Fab

Tata Electronics CEO Randhir Thakur and ASML President Christophe Fouquet signed an MoU with Narendra Modi and Rob Jetten present.
The $11 billion project will build a 300 mm wafer fab using ASML lithography tools.
The fab will produce 28-nm to 110-nm chips for automotive, mobile and AI with Powerchip Semiconductor Manufacturing Corp.
ASML will also support talent development, supply-chain resilience and R&D, with first chips expected before the end of 2026.

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