Full Breakdown
Taiwan Breaks Ground on Kaohsiung Advanced-Packaging Industrial Park
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Core Event: Groundbreaking of Baipu Industrial Park
On September 21, Taiwan held a groundbreaking ceremony in Kaohsiung’s Baipu Industrial Park to launch a new advanced-packaging hub. The project is anchored by Taiwan Semiconductor Manufacturing Co. (TSMC), which will build two facilities for a technology-validation laboratory and a talent-training centre. The site spans roughly 88.7 hectares (?219 acres), with 53.6 hectares earmarked for industrial use.
Background & Context
The park is part of Taiwan’s “Southern Semiconductor S-Corridor,” linking Kaohsiung’s Nanzih chip-manufacturing zone, Renwu packaging cluster, and Ciaotou materials hub. Rising AI and high-performance-computing demand has spurred the need for advanced packaging, which integrates multiple chips into a single package to boost performance. Expanding the ecosystem in the south aims to balance development across the island and keep Taiwan competitive in the global semiconductor supply chain.
Data & Statistics
- Total area: 88.7 ha (?219 acres) – Reuters.
- Industrial-use area: 53.6 ha – Reuters.
- Job creation: >4,000 positions – President Lai.
- Annual production value: NT$300 billion (?US$9.35 billion) – President Lai.
- Construction timeline: Two TSMC campuses slated for completion in the fourth quarter of 2029; full park infrastructure expected by 2031.
- Mini-Loop validation efficiency: 25 %–50 % improvement (Jun He).
- CoWoS capacity growth: >80 % CAGR through 2027 (Jun He).
Official Statements & Responses
- Deputy Mayor Lo Ta-sheng noted TSMC will occupy the park with two buildings, while the city will provide additional factory facilities.
- Jun He, TSMC Vice President of Advanced Packaging Technology and Service, said the “Mini-Loop” line will validate new equipment before CoWoS production, targeting a 25 %–50 % efficiency gain.
- Liao Tai-hsiang, Director-General of Kaohsiung’s Economic Development Bureau, described the park’s “demand-side + R&D-side + park-side” model as a node that will help traditional metal-processing and precision-machinery firms integrate into the high-value-added semiconductor supply chain.
- Minister of Economic Affairs Kung Ming-hsin and Minister of the Interior Liu Shyh-fang attended, underscoring inter-ministerial support.
On-the-Ground Reports
More than 20 semiconductor-related supply-chain companies attended, indicating strong industry interest before construction began. The Kaohsiung City Economic Development Bureau reported official designation approval from the Ministry of Economic Affairs on March 17.
Conflicting Reports & Gaps
Two sources give slightly different measurements for the park’s total size: Reuters cites 88.7 ha, while another outlet lists 88.73 ha. Both agree that roughly 53 ha are slated for industrial use. No further discrepancies were identified.
Verbatim Quotes
- “With the rapid development of AI and high-performance computing, advanced packaging has become a critical part of global semiconductor competition,” — President Lai Ching-te
What’s Next
- Completion of TSMC’s two campuses is scheduled for the fourth quarter of 2029; the entire park’s infrastructure is slated for 2031.
- Taiwan Power Co. will build an electricity distribution network, and the “pearl-string” water project will connect regional reservoirs and add treatment and desalination capacity.
- An inter-ministerial task force will address land, water, electricity, labor, and talent issues for prospective investors.